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| Memory Products In Brief . . . Motorola's memory product portfolio has been expanded to support a broad range of engineering applications. Included in this portfolio are asynchronous devices with access times of 6 ns at 256K-bit density, 6 ns at 5 V 1 Megabit density, 8 ns at 3.3 V 1 Megabit density, as well as synchronous FSRAMs with access times as fast as 4.5 ns and 7.5 ns. Motorola's Fast Static RAM Division goal is simple: speed. All of our SRAMs are designed to provide the highest performance, cost efficient solutions available. Flash memory is the most cost-effective non-volatile semiconductor memory. Motorola's Flash products can be easily programmed while remaining in the system. Fast Static RAMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Synchronous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Asynchronous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Fast Static RAM Modules . . . . . . . . . . . . . . . . . . . . . Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Standard MobileFLASHTM Memory . . . . . . . . . . . . . MobileFLASHTM Memory . . . . . . . . . . . . . . . . . . . . . . Flash Component Part Nomenclature . . . . . . . . . . . Page 2.8-2 2.8-2 2.8-2 2.8-3 2.8-4 2.8-5 2.8-6 2.8-6 2.8-7 Motorola Master Selection Guide 2.8-1 Memory Products Fast Static RAMs Introduction Motorola is designing the fastest, most technologically advanced fast SRAMs. From 0.8 to 0.5 m with access times as fast as 5 V 6 ns 256K, 6 ns 1M, 13 ns 4M, and 8 ns 3.3 V 1M; these devices are progressively smaller, faster, and lower cost. These SRAMs are designed to provide the highest performance, cost efficient solutions available. Selected fast SRAMs are also available on 2M and 8M memory modules. Application specific memories are designed for high-performance microprocessors that require more specialization from memory cache than is available from standard devices. Products include those for use with digital signal processors as well as a variety of popular microprocessors. SYNCHRONOUS Late Write RAMs Description 4M Organi- zation 256K x 18 VCC 3.3 V Motorola Part Number MCM69R818A MCM69R819A MCM69R820A MCM69L818A MCM69L819A MCM69L820A 128K x 36 MCM69R736A MCM69R737A MCM69R738A MCM69L736A MCM69L737A MCM69L738A Pin Count 119 119 119 119 119 119 119 119 119 119 119 119 Packaging (ZP) PBGA (ZP) PBGA (ZP) PBGA (ZP) PBGA (ZP) PBGA (ZP) PBGA (ZP) PBGA (ZP) PBGA (ZP) PBGA (ZP) PBGA (ZP) PBGA (ZP) PBGA Cycle Time (ns Max) 5/6/7/8 5/6/7/8 5/6/7/8 8.5/9/9.5 Latency 8.5/9/9.5 Latency 8.5/9/9.5 Latency 5/6/7/8 5/6/7/8 5/6/7/8 8.5/9/9.5 Latency 8.5/9/9.5 Latency 8.5/9/9.5 Latency Pro- duction Now Now Now Now Now Now Now Now Now Now Now Now Comments Late write interface. Register/Register. HSTL I/Os. Late write interface. Register/Register. LVTTL I/Os. Late write interface. Register/Register. 2.5 V I/Os. Late write interface. Register/Latch. HSTL I/Os Late write interface. Register/Latch LVTTL I/Os. Late write interface. Register/Latch 2.5 V I/Os. Late write interface. Register/Register. HSTL I/Os. Late write interface. Register/Register. LVTTL I/Os. Late write interface. Register/Register. 2.5 V I/Os. Late write interface. Register/Latch. HSTL I/Os. Late write interface. Register/Latch. LVTTL I/Os. Late write interface. Register/Latch. 2.5 V I/Os. Tag RAMs Description Tag RAMs Organi- zation 64K x 18 16K x 16 16K x 15 VCC 3.3 V 5V 5V Motorola Part Number MCM69T618 MPC27T416 MPC27T415 Pin Count 100 119 80 80 Packaging (TQ) TQFP (ZP) PBGA (TQ) TQFP (TQ) TQFP Access Time (ns Max) 5/6/7 9/10/12 9/10/12 Pro- duction Now Now Now Now Comments 100 MHz Data/Tag RAM. For MIPS R5000, Pentium Pro and graphics accelerators applications. Cache tag RAM for PowerPC. 14 tag bits, 2 status bits. Cache tag RAM for PowerPC. 12 tag bits, 3 status bits. Drop in replacement for IDT71216. CAMs CAMs 16K x 64 4K x 64 3.3 V 3.3 V MCM69C432 MCM69C232 100 100 (TQ) TQFP (TQ) TQFP 180 ns Match Time 160 ns Match Time 4Q97 Now Content addressable memory for communication applications. 16K connections. Content addressable memory for communication applications. 4K connections. Integrated Cache Solutions Integrated Cache Solutions S l ti 32K x 72 32K x 36 3.3 V 5V MPC2605 MPC2604GA 241 357 (ZP) PBGA (ZP) PBGA 66 MHz 66 MHz 4Q97 Now Integrated L2 cache for PowerPC processors.One component for 256KB, two for 512KB, and four for 1MB L2 cache solution. Integrated L2 cache for PowerPC processors.Two components for 256KB, four for 512KB L2 cache solution. Separate and Dual I/O Devices 4M 1M 512K x 9 128K x 9 32K x 36 5V 5V 3.3 V MCM67Q909 MCM67Q709A MCM69Q536 MCM69D536 64K x 18 3.3 V MCM69Q618 MCM69D618 Line Buffer 8K x 8 5V MCM62X308 86 86 176 176 100 100 28 (ZP) PBGA (ZP) PBGA (TQ) TQFP (TQ) TQFP (TQ) TQFP (TQ) TQFP 300 (J) SOJ 5/6 5/6 6/8/10 6/8/10 6/8/10 6/8/10 15/17 Now Now 4Q97 4Q97 4Q97 4Q97 Now General synchronous separate I/O with write pass through. 3.3 V output levels. General synchronous separate I/O with write pass through. 3.3 V output levels. Replaces the MCM67Q709. Single address, separate I/O. NetRAM. Sampling now. Dual address, dual I/O. NetRAM. Sampling now. Single address, separate I/O. NetRAM. Sampling now. Dual address, dual I/O. NetRAM. Sampling now. Line buffer for processing digital data. Sampling now. Memory Products 2.8-2 Motorola Master Selection Guide SYNCHRONOUS BurstRAMs Description 4M Organi- zation 256K x 18 VCC 3.3 V Motorola Part Number MCM69P819 MCM69F819 128K x 36 3.3 V MCM69P737 MCM69F737 128K x 32 3.3 V MCM63P733 MCM63F733 2M 64K x 32 3.3 V MCM63P631 Pin Count 100 119 100 119 100 119 100 119 100 100 100 -- MCM63PV631 32K x 32 1M 64K x 18 3.3 V 3.3 V MCM63P535 MCM69F618C MCM69P618C 5V MCM67B618A MCM67B618B MCM67C618A MCM67C618B MCM67M618A MCM67M618B 32K x 36 3.3 V MCM69F536B MCM69F536C MCM69P536B MCM69P536C 100 -- 100 100 52 52 52 52 52 52 100 100 100 100 Packaging (TQ) TQFP (ZP) PBGA (TQ) TQFP (ZP) PBGA (TQ) TQFP (ZP) PBGA (TQ) TQFP (ZP) PBGA (TQ) TQFP (TQ) TQFP (TQ) TQFP (DW) TrueDie (TQ) TQFP (DW) TrueDie (TQ) TQFP (TQ) TQFP (FN) PLCC (FN) PLCC (FN) PLCC (FN) PLCC (FN) PLCC (FN) PLCC (TQ) TQFP (TQ) TQFP (TQ) TQFP (TQ) TQFP Access Time (ns Max) 3.5/3.8/4 7.5/8/8.5/11 3.5/3.8/4 7.5/8/8.5/11 4/4.5/5 10/11 117 MHz 4.5/7/8 ns 4.5/7/8 ns 133/117/66/60 MHz 4.5/7/8 8.5/9/10/12 4/4.5/5/6/7 8.5/9/10/12 8.5/9/10/12 5/7 5/7 9/10/12 9/10/12 8.5/9/10/12 8.5/9/10/12 4/4.5/5/6/7 4/4.5/5/6/7 Pro- duction 1Q98 1Q98 1Q98 1Q98 1Q98 1Q98 Now 4Q97 Now 4Q97 4Q97 4Q97 Now 4Q97 Now 4Q97 Now 4Q97 Now 4Q97 Now 4Q97 Comments Pipelined BurstRAM for servers, switches, and workstations. XCM available now. Flow-through BurstRAM for servers, switches, and workstations. XCM available now. Pipelined BurstRAM for servers, switches, and workstations. XCM available now. Flow-through BurstRAM for servers, switches, and workstations. XCM available now. 133 MHz pipelined BurstRAM, for servers and notebooks. Sampling now at 100 MHz. 75 MHz flow-through BurstRAM, for servers and datacomm. 117 MHz pipelined BurstRAM, for desktop PCs and communications applications. Pipelined BurstRAM for ultraportable computing. 2.5 V I/O GreenRAM. For MMX processor, notebooks, and low-power communication applications needs. Pipelined BurstRAM for ultraportable computing. 5 V tolerant on all pins. Samples 3Q97. 5 V tolerant on all pins. Samples 3Q97. Flow-through BurstRAM for PentiumTM, MIPS. Not for new designs, suggest MCM67B618B. Flow-through BurstRAM for Pentium, MIPS. Pipelined BurstRAM for Pentium. Not for new designs, suggest MCM67C618B. Pipelined BurstRAM for Pentium and communication applications. Flow-through BurstRAM for PowerPCTM. Not for new designs, suggest MCM67M618B. Flow-through BurstRAM for PowerPC. Flow-through BurstRAM, 5 V tolerant I/Os. Not for new designs, suggest MCM69F536C. 5 V tolerant on all pins. Samples 3Q97. Pipelined BurstRAM, 5 V tolerant I/Os. Not for new designs, suggest MCM69P536C. 5 V tolerant on all pins. Samples 3Q97. ASYNCHRONOUS Density 4M Organi- zation 512K x 8 VCC 5V 5V 3.3 V 256K x 16 1M x 4 3.3 V 5V 5V 3.3 V 3M 1M 128K x 24 64K x 18 3.3 V 5V 5V 64K x 16 3.3 V 3.3 V 128K x 8 5V 5V 5V 3.3 V 3.3 V 256K x 4 5V Motorola Part Number MCM6246 MCM6246A MCM6946 MCM6343 MCM6249 MCM6249A MCM6949 MCM6341 MCM67A618A MCM67A618B MCM6323 MCM6323A MCM6226BB MCM6726C MCM6726D MCM6326 MCM6926A MCM6229BB Pin Count 36 36 36 44 44 32 32 32 119 52 52 44 44 32 32 32 32 32 28 Packaging Package width in mils 400 (WJ) SOJ 400 (WJ) SOJ 400 (YJ) SOJ 400 (YJ) SOJ TSOP 400 (WJ) SOJ 400 (WJ) SOJ 400 (YJ) SOJ (ZP) PBGA (FN) PLCC (FN) PLCC 400 (YJ) SOJ 400 (YJ) SOJ (TS) TSOP 300 (EJ), 400 (XJ) SOJ 400 (WJ) SOJ 400 (WJ) SOJ 400 (YJ) SOJ 400 (WJ) SOJ 300 (EJ), 400 (XJ) SOJ Access TIme (ns Max) 17/20/25 15 10/12/15 10/12/15 20/25/35 15 10/12/15 10/12/15 10/12/15 10/12/15 12/15 10/12/15 15/17/20/25 6/7 7.5/8/10/12 12/15/20 8/10/12/15 15/17/20/25 Pro- duction Now Now 1Q98 2Q98 Now Now 1Q98 1Q98 Now Now Now 4Q97 Now Now Now 1Q98 Now Now Comments Output enable. Revolutionary pinout. For switches and basestations. For telecom, storage and computing applications. Samples 4Q97. For telecom, modems, cellular, storage and computing applications. Samples 1Q98. Output enable. Revolutionary pinout. Replaces MCM6249. For switches, routers and basestations. For telecom, storage, and computing applications. Samples 4Q97. DSP applications for base stations, cost, and other communication applications. Samples late 4Q97. Not recommended for new designs. Suggest MCM67A618B. General asynchronous, latched address and data. Not recommended for new designs. Suggest MCM6323A. Industrial temperature offered. Revolutionary pinout. DSP applications. Samples 3Q97. Evolutionary pinout. Revolutionary pinout. Revolutionary pinout. Revolutionary pinout. Samples January 98. Revolutionary pinout. Evolutionary pinout. Motorola Master Selection Guide 2.8-3 Memory Products ASYNCHRONOUS Density Organi- zation VCC 5V 5V 3.3 V 1M x 1 5V 5V DSPRAM 256K 8K x 24 32K x 8 5V 5V 5V 5V 5V 5V 5V 64K x 4 5V 5V Motorola Part Number MCM6229CA MCM6729D MCM6929A MCM6227B MCM6227BB MCM56824A MCM6206BA MCM6206BB MCM6706B MCM6706BR MCM6706D MCM6706DR MCM6709B MCM6709BR Pin Count 28 32 32 28 28 52 28 28 28 32 28 32 28 28 Packaging Package width in mils 300 (EJ), 400 (XJ) SOJ 400 (WJ) SOJ 400 (WJ) SOJ 300 (J), 400 (WJ) SOJ 300 (J), 400 (WJ) SOJ (FN) PLCC 300 (EJ) SOJ 300 (EJ) SOJ 300 (J) SOJ 300 (J) SOJ 300 (J) SOJ 300 (J) SOJ 300 (J) SOJ 300 (J) SOJ Access TIme (ns Max) 15/17/20/25 7.5/8/10/12 8/10/12/15 15/17/20/25 15/20/25 20/25/35 12/15/20/25 12/15/20/25 8/10 6/7/8 8/10 6/7/8 8/10 6/7/8 Pro- duction 1Q98 Now Now Now 1Q98 Now Now 4Q97 Now Now 1Q98 1Q98 Now Now Comments Replaces MCM6226BB. Evolutionary pinout. Samples 4Q97. Revolutionary pinout. Revolutionary pinout. For telecom, IC tester applications, and storage. Replaces MCM6227B. For telecom, IC tester applications, and storage. Samples available 4Q97. Designed for DSP56001 applications. Replaces 32K x 8s. Not recommended for new designs. Suggest MCM6206BB. Replaces MCM6206BA. Evolutionary pinout. Not recommended for new designs. Suggest MCM6706D. Revolutionary pinout. Not recommended for new designs. Suggest MCM6706DR. Evolutionary pinout. Samples late 4Q97. Revolutionary pinout. Samples late 4Q97. Evolutionary pinout. Not recommended for new designs. Revolutionary pinout. Not recommended for new designs. FAST STATIC RAM MODULES (Contact Fast Static RAM Marketing for Custom Fast SRAM Modules) Desktop Computing Applications Description PowerPC Cache Modules Mdl Coast Modules Organization and Function 64K x 72 Flow-Through Burst 128K x 72 Flow-Through Burst 64K x 64 Pipelined Burst Access Time 9 ns 9 ns 8 ns 160 Pin Card Edge DIMM (DG) Packaging 178 Pin Card Edge DIMM (DG) g ( ) Production Now Now Now Motorola Part Number MPC2105B MPC2106B MCM64PE64 Data Communications Applications Standard BurstRAM Modules 64K x 72 Flow-Through Burst 128K x 72 Flow-Through Burst 256K x 72 Flow-Through Burst 512K x 72 Flow-Through Burst Standard BurstRAM Multichip Packages 256K x 72 Flow-Through Burst 256K x 72 Pipelined Burst 512K x 36 Flow-Through Burst 512K x 36 Pipelined Burst 9/12 ns 9/12 ns 8/12 ns 8/12 ns 7.5/8 ns 3.5/4 ns 7.5/8 ns 3.5/4 ns 168 Pin DIMM (DG) 168 Pin DIMM (DG) 168 Pin DIMM (DG) 168 Pin DIMM (DG) Multichip Module on Laminate (ML) 3Q97 3Q97 4Q97 4Q97 4Q97 4Q97 4Q97 4Q97 MCM72F6DG MCM72F7DG MCM72F8DG MCM72F9DG MCM72FB8ML MCM72PB8ML MCM36FB9ML MCM36PB9ML Memory Products 2.8-4 Motorola Master Selection Guide Flash Memory Motorola Master Selection Guide Flash memory is the most cost-effective non-volatile semiconductor memory. Flash possesses a distinct advantage over traditional non-volatile memories in that it can be easily programmed while remaining in the system. Motorola's low power flash memory products are ideally suited for portable cellular phones, handheld electronic devices, networking equipment and telecom applications. Please contact your Motorola sales representative for more information. 2.8-5 Memory Products STANDARD MobileFLASHTM MEMORY Organization 1M x 8 or 512K x 16 1M x 8 or 512K x 16 1M x 8 or 512K x 16 1M x 8 or 512K x 16 48 Pin TSOP 48 Pin Reverse TSOP 48 Pin TSOP 48 Pin Reverse TSOP Top Top Bottom Bottom 3.3 Volt 3.3 Volt 3.3 Volt 3.3 Volt 80, 100, 120 ns 80, 100, 120 ns 80, 100, 120 ns 80, 100, 120 ns Package Options Boot Block Power Supply Speed Production NOW NOW NOW NOW Memory Products Organization 1M x 8, 512K x 16 1M x 8, 512K x 16 1M x 8, 512K x 16 1M x 8, 512K x 16 48 Pin TSOP 48 Pin TSOP .65 pitch BGA .65 pitch BGA Top Bottom Top Bottom VCC = 3.3 V, VPP = 5.0 V VCC = 3.3 V, VPP = 5.0 V VCC = 3.3 V, VPP = 5.0 V VCC = 3.3 V, VPP = 5.0 V Package Options Boot Block Power Supply Speed 120 ns 120 ns 120 ns 120 ns Production NOW NOW 2Q98 2Q98 Motorola Part Number Density M29F800A3UT M29F800A3UR M29F800A3BT M29F800A3BR 8 Mbit 8 Mbit 8 Mbit 8 Mbit MobileFLASHTM MEMORY WITH BACKGROUND OPERATION Motorola Part Number Density M28F800A2UT12 M28F800A2UR12 M28F800A2UA12 M28F800A2BA12 8 Mbit 8 Mbit 8 Mbit 8 Mbit 2.8-6 Motorola Master Selection Guide FLASH DINOR I COMPONENT PART NOMENCLATURE Digit 1 M 2 8 F 8 0 0 A 3 K B T 1 2 R Shipping R = Tape and Reel Blank = Tray J = Tube Speed 12 = 120 ns 10 = 100 ns 80 = 80 ns Package J = SOJ T = TSOP R = Reverse TSOP A = 0.65 mm CSP Architecture F = Flashfile U = Top Boot Block B = Bottom Boot Block S = Serial 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Motorola Master Selection Guide Power Supply 29F = 1 Power Supply 28F = 2 Power Supplies Die Revision Match Die Rev of Supplier, If No Supplier then, O = Original Rev. A = 1st Gen. B = 2nd Gen. C = 3rd Gen. Voltage 5 = 5.0 V 3 = 3.3 V 2 = 2.7 V 1 = 1.8 V 9 = 0.9 V Lead Frame Blank = MTB (alloy) Temperature/Burn-In Blank = Comm. with Burn-In K = Indust. with Burn-In F = Extend. with Burn-In C = Comm. without Burn-In I = Indust. without Burn-In E = Extend. without Burn-In Device Status M = Motorola Qualified Device S = Custom Product (Copper) E = Engineering Sample X = Pre-Qualified Device Density/Configuration 040 = 4M x 8 400 = 4M x 8 / x 16 080 = 8M x 8 800 = 8M x 8 / x 16 016 = 16M x 8 160 = 16M x 8 / x 16 2.8-7 Memory Products |
Price & Availability of MCM69R818A
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